Archive

Archive

POETICS

Copackaging of terabit direct-detection and coherent optical engines and switching circuits in multi-chip modules for datacenter networks and the 5G optical fronthaul.

(Funded by the European Union)

Duration: January 2021 – August 2023

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TERIPHIC

Fabrication and assembly automation of TERabit optical transceivers based on InP EML arrays and a Polymer Host platform for optical InterConnects up to 2 km and beyond

(Funded by the European Union)

Duration: January 2019 – September 2022

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InPulse

Indium-Phosphide Pilot Line for up-scaled, low-barrier, self-sustained, PIC ecosystem

This project is funded by the European Union's Horizon 2020 research and innovation programme.

Duration: January 2019 - December 2022

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optION

Optical Microring Sensor for quantitative Analysis of Electrolytes

(Funded by the German Federal Ministry of Education and Research)

Duration: Februar 2019 – Oktober 2022

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ProtoPIC

Platform for KMU-access for rapid prototype development of photonic integrated circuits

(Fraunhofer SME Project)

Duration: January 2020 - December 2022

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LZDV IV

(Fraunhofer Project)

Duration: January 2022 - December 2022

HIGHLAND

(Fraunhofer Project)

Duration: June 2020 – April 2022

T-KOS

Terahertz Technologies for Communication and Sensor Technology

Duration: May 2021 – August 2022

LZDV Phase III

Duration: January 2021 - December 2021

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QBaseTech

Laufzeit: Februar 2021 – Januar 2022

Weiterlesen

UNIQORN

Affordable Quantum Communication for Everyone: Revolutionizing the Quantum Ecosystem from Fabrication to Application

Duration: October 2018 - July 2022

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PIXAPP

PIXAPP provides the full range of assembly and integration technologies needed to package multifunctional PIC (Photonic Integrated Circuit) devices, across all stages of manufacturing - from prototyping to medium scale manufacture.

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CiViQ

Applying CV-QKD in Existing Telecom Infrastructure

Duration: October 2019 – September 2022

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QAMeleon

EU Project QAMeleon to develop the next generation of photonics and electronics technology that will enable 128 Gbaud optical data flow generation, reception and switching over an SDN platform.

(Funded by: EU)

Duration: January 2018 - December 2021

www.ict-qameleon.eu

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3PEAT

3D Photonic integration platform based on multilayer PolyBoard and TriPleX technology for optical switching and remote sensing and ranging applications.

(Funded by: EU)

Duration: January 2018 – January 2022

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PolyPhotonics Berlin

Optical components made of polymer

(Funded by: Federal Ministry of Education and Research)

Duration: September 2016 – August 2020

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PHONOGRAPH

Graphene-based photonic integration technologies for wireless terabit communication systems

Duration: September 2016 – August 2020

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HIPPIOS

ProFIT-Projekt “High-Port Photodiode Integrated Optical Spectrometer”

Project Financing: European Regional Development Fund (ERDF) and Investitionsbank Berlin (IBB)

Duration: January 2018 - December 2019

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Phoenix+

Photonics & Optoelectronics Network

Project Financing: Programme for Internationalisation (PfI) - Promotion of Network Building

Duration: November 2016 - October 2019

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HAMLET

Heterogeneous Advancement and hybrid integration of polyMer and tripLEx platform for integrated microwave phoTonics

Duration: December 2015 – May 2019

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SPEED

Silicon Photonics Enabling Exascale Data Networks

Duration: November 2015 – November 2018

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PANTHER

PAssive and electro-optic polymer photonics and InP electronics iNtegration for multi-flow Terabit transceivers at edge SDN switcHes and data-centER gateways

Duration: January 2014 – December 2016

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SPIRIT

SPIRIT focus is the development of a programmable optical transceiver for next-generation flexible optical networks which includes multi-level modulators, flexible wavelength MUX/DEMUXs and high-speed receivers.

Duration: 2013 – 2016

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ACTPHAST

Access CenTer for PHotonics innovAtion Solutions and Technology Support

Duration: November 2013 – October 2017

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100x100 Optics

Co-funded by: Future Fond Berlin and European Regional Development Fund

Duration: 07/2008 - 08/2011


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ADVAntagePON

Co-funded by: Federal Ministry of Education and Research (BMBF)

Duration: 07/2011 - 06/2014


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ASTRON (Adaptive Software defined Terabit Transceiver for flexible Optical Networks)

www.ict-astron.eu/

Co-funded by: Framework 6 of European Commission Development Fund

Duration: 10/2012 - 09/2015

Berlin-Access

Test bed and technologies for broadband optical subscriber lines. Part B: Components

Co-funded by: Future Fond Berlin and European Regional Development Fund (TSB)

Duration: 07/2005 - 05/2008


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EuroPIC (European manufacturing platform for Photonic Integrated Circuits)

Co-funded by: Framework 7 of European Commission Development Fund

Duration: 09/2009 - 08/2012


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HiLight

July 2011 – June 2014

HiLight – Hochlinearer Optischer Empfänger für digitale 400 Gb/s Systeme

Funded by Federal Ministry of Education and Research

In Cooperation with u2t Photonics AG, IHP GmbH

Detectors Group

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HINT

October 2010 – March 2013

HINT – Hochauflösende Infrarot-Niedertemperatur-Thermometrie auf der Basis von III/V Halbleitersensoren

Funded by Federal Ministry of Education and Research

In Cooperation with Optris GmbH, Micro-Sensors GmbH

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MiniWDM

Miniaturized optical polymer chips for wavelength division multiplex (WDM) transmission in future optical broadband communication systems

Co-funded by: Federal Ministry for Economic Affairs and Energy (BMWi)

Duration: 01/2008 - 12/2010


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MIRTHE

MIRTHE targets new multilevel-modulation all-monolithic integrated TX and RX Photonic Integrated Circuits (PICs) able to achieve 100-400 Gb/s aggregated speed on a single wavelength.

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NAPOLY (New applications of polymers for passive optical components)

Co-funded by: ALCATEL SEL AG, ZFZ/OC, Stuttgart, Germany

Duration: 03/1998 - 12/2003


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PARADIGM (Photonic Advanced Research And Development for Integrated Generic Manufacturing)

Co-funded by: Framework 7 of European Commission Development Fund

Duration: 10/2010 - 08/2014


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PICASSO

Photonic Integrated Components Applied to Secure chaoS encoded Optical communications systems

www.picasso.di.uoa.gr

PolyBoard

Co-funded by: Federal Ministry of Education and Research (BMBF)

Duration: 12/2011 - 11/2013


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PolyMUX

Co-funded by: Federal Ministry of Education and Research (BMBF)

Duration: 07/2001 - 06/2004


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POLYPLANAR (Modular system components based on planar optical polymer chips)

Co-funded by: Bundesministerium für Bildung und Forschung (BMBF)

Duration: 05/2008 - 01/2011


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POLYSYS

www.ict-polysys.eu/

Duration: 10/2010 - 09/2013

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POWER (Polymer optical waveguide enhanced router)

Co-funded by: PIRELLI Cavi SPA, Milan, ItalyDuration: 02/1998 - 01/2000

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10Gb/s TOSA with extended temperature range

Co-funded by: Federal Ministry for Economic Affairs and Energy (BMWi)

Duration: 07/2007 - 12/2008

Topic: 1490nm and 1550nm transmitter module for 10Gb/s operation


Martin Möhrle

OTUS-ESA

Co-funded by: Framework 6 of European Commission Regional Development Fund

Duration: 11/2006 - 11/2008

Topic: design, manufacturing and test of a representative end-to-end breadboard of an ultra-fast and high-throughput optical switch

APACHE (Agile Photonic Integrated Systems-on-Chip enabling WDM Terabit Networks)

Co-funded by: Framework 7 of European Commission Development Fund

Topic: The APACHE project aims to design and develop new generation of transmitter, receiver and regenerator photonic circuits capable to handle 100 Gb/s data rates and a multiplicity of modulation formats that will enhance the transmission efficiency of optical fiber. APACHE exploits hybrid integration technology for delivering Terabit capacity on a single photonic integrated circuit.

On the physical layer APACHE aims at extending photonic circuit integration capabilities. Its integration concept relies on the combination of Indium-Phosphide monolithic elements, silicon submounts and silica-on-silicon planar lightwave circuits.

Karl-Otto Velthaus

BOOM

Micro and nano-scale silicon photonic integrated components and sub-systems enabling Tb/s-capacity, scalable and fully integrated photonic routers

Co-funded by: Framework 7 of European Commission Development Fund

Topic: BOOM is an integration project that aims to pursue the systematic davancement of Silicon-on-Insulator (SOI) integration technology to develop compact, cost-effective and power efficient silicon photonic components that enable photonic Tb/s capacity systems for current and new generation high speed broadband core networks.

COMAN (Components for Optical Monitoring in Access Networks)

Co-funded by: Federal Ministry of Education and Research (BMBF)

Duration: 02/2007 - 01/2009

Topic: optical transceiver with integrated monitoring functions


Martin Möhrle

CONDOR (Converged Heterogeneous Metro/Access Infrastructure)

Co-funded by: Federal Ministry of Education and Research (BMBF)

Duration: 04/2010 - 03/2013

Cooperation: Alcatel-Lucent, UKA-IPQ, UKA-ITIV, JDSU, Leoni, FhG-HHI

Topic:

  • widely tunable 10G hybrid lasers comprising of an InP gain chip and a  polymer grating
  • high speed lasers for OFDM applications


Martin Möhrle

EIBONE

Co-funded by: Federal Ministry of Education and Research (BMBF)

Duration: 09/2005 - 08/2008

Cooperation: Fraunhofer-HHI (InP chips), TU-Berlin (SOI board technology) und u2t Photonics AG (module technology)

Topic: Design and fabrication of flip-chip mountable balanced photodiodes and SOA-Chips, to be placed on an SOI-based D(Q)PSK network board, to achieve a 50 Gbit/s D(Q)PSK-Photoreceiver

GIBON

www.ist-gibon.eu/

Co-funded by: Framework 6 of European Commission Development Fund

Topic: The focus of GIBON is on the demonstration of the highest speed components that integrate the optoelectronic transducers (light modulator and photodiode) with their driving electronics (driver and preamplifier respectively). New transmitters and receivers will be developed based on designs experienced at lower bit rates (40 and 80 Gbit/s) and their characteristics will be optimised in order to match specifications that will be derived from systems considerations. In order to reach the 100 Gbit/s objective, the integration technology that will be used for the transceivers is as important as the optoelectronic devices characteristics. Guidelines for the design and realization of integrated devices as well as for the components packaging will be given by a supporting Electro-Magnetic simulation activity. This project will be completed by an assessment of the fabricated components with respect to the projected.

HECTO

www.hecto.eu/

Co-funded by: Framework 6 of European Commission Development Fund

Topic: The objective of HECTO is development of photonic components, transmitter and receiver, for high-performance and high-speed but cost-efficient communication systems. Applications are Time Division Multiplexed (TDM) optical systems with up to 160Gbit/s as well as optical packet-switching networks based on serial 100GbE signals requiring about 110Gbit/s. Especially, receivers with bandwidths of 100GHz and above will be developed with waveguide pin photodetectors integrated with electronic amplifiers, and the required high-speed electronics for electrical clock recovery and demultiplexing to lower speeds. The components will be tested in systems experiments. To ensure that they will meet the demands of the future market, technology application assessment will accompany the technical investigation and development.

SFB 787

www.sfb787.tu-berlin.de/menue/home/

Co-funded by: German Research Council (DFG)

Duration: 01/2008 - 12/2011

Mephisto (Merger of Electronics and Photonics Using Silicon Based Technologies)

Co-funded by: Framework 6 of European Commission Development Fund

Duration: 08/2004 - 10/2008

Topic: integrated wavelength division multiplexing transmitter component

OptiDot

Al-free quantum dot laser structures: technology and optical properties

Co-funded by: IBB Berlin/PROFIT program and European Regional Development Fund

Duration: 01/2006 - 12/2007

Cooperation: TU Berlin

Topic: Optical quantum dot materials based on InP