Hybrid PICs - Best of All Worlds
Hybrid photonic integration for communication, sensing and quantum applications
The Hybrid PICs research group develops photonic components and hybrid integrated circuits based on PolyBoard, SiN, and TFLN, combined with active elements made of InP, GaAs, or GaN. This platform enables the realization of complex photonic integrated circuits for applications like fiber-optical communications, quantum technologies, or sensing.
SiN Integration Platform
Scalable and flexible Silicon Nitride platform for actives-passives integration
The SiN Integration Platform with its low-loss waveguides enables the efficient hybrid integration of active elements from materials like InP, GaAs and PolyBoard. It covers a broad wavelength range from VIS to NIR and the customizable designs are available in different SiN thicknesses.
Photonic Biosensors
Label-free sensing for Point-of-Care and near real-time analysis
Biosensors based on photonic integrated circuits enable highly sensitive, multiplexed and label-free detection in compact chip-based formats. Their scalable design supports integration into portable devices for Point-of-Care, near real-time analysis in diagnostics, life sciences and environmental monitoring.
Narrow Linewidth and Mode-Locked Lasers
Ultra-stable laser sources for maximum precision and speed
Highly stable laser sources with ultra-narrow linewidths and tunable repetition rates enable precise applications in communications, metrology, and integrated photonics. The combination of mode-locked and tunable laser designs provides high performance and flexible integration into photonic systems.
Multi-Wavelength Tunable Lasers from NIR down to VIS
One laser, multiple wavelengths – maximum flexibility from NIR to VIS
Tunable multi-wavelength laser sources covering wavelengths from near-infrared to visible enable flexible solutions for communications, sensing, and analytics. Integration into photonic integrated circuits allows compact, high-performance, and application-specific systems.
Photon Pair Source
Compact entangled photon pair source for quantum applications
The compact photon pair source enables the generation of entangled photon pairs directly on a chip. It utilizes the PolyBoard wafer technology and the micro-optical bench, together with the hybrid integration of nonlinear crystals to implement a photonic integrated circuit for quantum technologies.
Micro Optical Bench
Compact, highly flexible integration of micro-optical functions and elements on PICs
The micro-optical bench based on the PolyBoard integration platform provides a precise and compact solution for integrating optical components on chip level. The modular design offers high flexibility and is ideal for a wide range of applications in telecom & datacom, sensing and quantum technology.
Micro Optical Elements
Customizable micro optical components for versatile on chip integration
The low-cost micro optical elements offer a flexible and compact solution for integration of lenses, isolators, circulators and more into photonic integrated circuits. Manufactured with the highest precision, these components are ideal for applications like telecommunications, sensing, and quantum technology.
GRIN Lenses
Customizable microlenses for high-precision optical coupling
GRIN lenses with a 125 μm diameter enable efficient coupling into integrated optical systems. Offered with various numerical apertures, lengths, and anti-reflective coatings, they are ideal for applications such as beam shaping, single-mode fiber coupling, and on-chip integration.
RF-Flexible-Interconnection-Line
High speed flexible electrical chip-to-chip interconnect up to 200 GHz
RF-Flexible-Interconnection-Line is a fully customizable polymer embedded electrical coplanar waveguide that enables flexible and cost-effective interconnection of, e.g., drivers to lasers or photodetectors to transimpedance amplifiers.