Backend & Packaging

The Backend and Packaging group separates the photonic components developed at Fraunhofer HHI into chips and carries out optical coating processes. They also assemble the devices into demonstration modules and submounts.


The Backend group develops and carries out processes for separation and optical coating of Indium-phosphide-chips (InP).

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The Packaging group constructs modules to demonstrate the capabilities of the optical and optoelectronic devices which are developed at Fraunhofer HHI. This includes optical fiber coupling as well as electrical interfaces with RF connectors.

Additionally they design and construct tailor-made module prototypes or submounts for all external partners and customers.

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