FOE 2017

APR 2017

5 - 7

Tokyo, Japan

The Fraunhofer Heinrich Hertz Institute HHI is a world leader in the development for mobile and optical communication networks and systems as well as processing and coding of video signals. Together with international partners from research and industry, Fraunhofer HHI works in the whole spectrum of digital infrastructure – from fundamental research to the development of prototypes and solutions.

At FOE 2017 Fraunhofer HHI presents the latest developments in Photonic Components, Systems and Networks at Fraunhofer booth 30-36, Hall 1, April 5-7, Japan, Tokyo.

Press Contact

Gesine Rodenkirchen

Gesine Rodenkirchen

Press Officer

Phone +49 30 31002-242

Terahertz sensing

Industrial grade THz-System for non-destructive testing (NDT)

Terahertz radiation has great potential as versatile tool for non-destructive testing. Up to now, the application of THz technologies in industrial environments is severely impeded due to the complexity of today’s THz sensor heads. Especially reflection measurements suffer from bulky and expensive devices.

Fraunhofer HHI presents a novel, compact THz-transceiver module, which enables measurements under normal incidence. This significantly facilitates the use of THz technologies for industrial applications.

Technical Contact

Prof. Dr. rer. nat. Björn Globisch

Prof. Dr. rer. nat. Björn Globisch

Head of Terahertz Sensor Systems Group

Phone +49 30 31002-415

Hybrid Optical Wireless/60GHz Link

The robust, hybrid LED Link with parallel 60 GHz transmission is well suited for mobile backhauling with low latency and high availability. The technology is also suitable for wireless point-to-point communication in industrial environments.

Technical Contact

Dr.-Ing. Dominic Schulz

Dr.-Ing. Dominic Schulz

Project Manager

Phone +49 30 31002-694

InP Foundry Services

Photonic Integration Toolbox

Fraunhofer HHI enables self-configuration of InP-Based Photonic-Integrated Circuit (PIC) containing passive- and active devices on one substrate with a quick turn-around time of 3 months. Choose from a range of proven building blocks, such as 40 GHz receivers, 20 GHz DMLs and EAMs, and 1 dB/cm passive waveguides. Low-cost multi-project wafer-run-based PICs are already commercially available through Jeppix and customer-specific private runs can be realized on demand. Dedicated design and layout software is provided, and several packaging partners are available.

Technical Contact

Dr.-Ing. Francisco Soares

Dr.-Ing. Francisco Soares

Project Manager

Phone +49 30 31002-141

PolyBoard Foundry Services

The Integration Platform for Your Ideas

The PolyBoard integration platform allows for rapid prototyping, short iteration cycles and low upfront development effort. The technology allows the integration of on-chip free space elements, 3D structures, graphene electro-absorption modulators, as well as other optical functionalities such as switches, variable optical attenuators, tunable lasers, and flexible high frequency and optical interconnects. Come to the Fraunhofer booth to learn about the services including simulation, CAD, technology development, device manufacturing, characterization, and qualification.

Technical Contact

Dr. Moritz Kleinert

Dr. Moritz Kleinert

Project Manager

Phone +49 30 31002-380

High-Speed Real-Time Digital Signal Processing Platform

The highly flexible FPGA-based development and demonstration platform is suitable for signal processing algorithms and real-time data transmission. The platform includes 65GSa/s DACs, 56GSa/s ADCs, 100GbE-class optical interfaces and Virtex Ultrascale/Ultrascale+ FPGA processing capabilities in a robust, 19’’-housing.

Technical Contact

Dr.-Ing. Robert Elschner

Dr.-Ing. Robert Elschner

Project Manager

Phone +49 30 31002-443