Photonics West 2017

JAN - FEB 2017

28 - 2

San Francisco, USA

The Fraunhofer Heinrich Hertz Institute HHI is a world leader in the development for mobile and optical communication networks and systems as well as processing and coding of video signals. Together with international partners from research and industry, Fraunhofer HHI works in the whole spectrum of digital infrastructure – from fundamental research to the development of prototypes and solutions.

At Photonics West 2017 Fraunhofer HHI presents the latest developments in Photonic Networks, Systems and Components at Fraunhofer booth 4629-28, from January 28 to February 2 2017, in San Francisco, USA.

Press Contact

Gesine Rodenkirchen

Gesine Rodenkirchen

Press Officer

Phone +49 30 31002-242

InP Foundry Services

Photonic Integration Toolbox

Fraunhofer HHI enables self-configuration of InP-Based Photonic-Integrated Circuit (PIC) containing passive- and active devices on one substrate with a quick turn-around time of 3 months. Choose from a range of proven building blocks, such as 40 GHz receivers, 20 GHz DMLs and EAMs, and 1 dB/cm passive waveguides. Low-cost multi-project wafer-run-based PICs are already commercially available through Jeppix and customer-specific private runs can be realized on demand. Dedicated design and layout software is provided, and several packaging partners are available.

Technical Contact

Dr.-Ing. Francisco Soares

Dr.-Ing. Francisco Soares

Project Manager

Phone +49 30 31002-141

PolyBoard Foundry Services

The Integration Platform for Your Ideas

The PolyBoard integration platform allows for rapid prototyping, short iteration cycles and low upfront development effort. The technology allows the integration of on-chip free space elements, 3D structures, graphene electro-absorption modulators, as well as other optical functionalities such as switches, variable optical attenuators, tunable lasers, and flexible high frequency and optical interconnects. Come to the Fraunhofer booth to learn about the services including simulation, CAD, technology development, device manufacturing, characterization, and qualification.

Learn more in our talks “Photonic integrated devices and functions on hybrid polymer platform” on Wednesday, February 1st at 3:30 PM and “Gbit/s-operation of graphene electro-absorption modulators in a passive polymer waveguide platform for data- and telecommunications” on Thursday, February 2nd at 08:40 AM.

Technical Contact

Dr. Moritz Kleinert

Dr. Moritz Kleinert

Project Manager

Phone +49 30 31002-380

Terahertz sensing

Non-destructive, contact free measurements with Terahertz

Terahertz radiation is increasingly being used in the industrial environment for purposes of material investigation. Layer thicknesses of coatings, the geometry of polymer components or imperfections in non-conductive materials can be investigated. Another field of application is the spectroscopic investigation of gases.

Technical Contact

Dr.-Ing. Joachim Giesekus

Dr.-Ing. Joachim Giesekus

Phone +49 30 31002-425

High-Speed Real-time Digital Signal Processing Platform

Highly flexible FPGA-based development and demonstration platform for signal processing algorithms and real-time data transmission. The platform includes 65GSa/s DACs, 56GSa/s ADCs, 100GbE-class optical interfaces and Virtex Ultrascale/Ultrascale+ FPGA processing capabilities in a robust, 19’’-housing.

Technical Contact

Dr. rer. nat. Colja Schubert

Dr. rer. nat. Colja Schubert

Head of Submarine and Core Systems Group

Phone +49 30 31002-252

Visible Light Communication up to 1 Gbit/s

LED-lamps, normally used for lighting purposes, securely transmit data at high speed and low latency even in environments where radio encounters difficulties. The standard RJ45 interface enables the fast integration into existing networks and the use for different applications like distribution of high-definition video streaming as well as two-way communication.

Technical Contact

Dr.-Ing. Anagnostis Paraskevopoulos

Dr.-Ing. Anagnostis Paraskevopoulos

Project Manager

Phone +49 30 31002-527

Optical Ultra-thin Glass Seal

Planar ultra thin glass seals with optical fiber interface for monitoring tamper attacks on security eminent components

Physical Protection of sensible, security eminent electronics is very important and increasingly challenging for many private companies or public institutions.  The financial damage or the consequences (e. g. , data manipulation or data recordings) of an unrecognized attack can be huge. Hence, together with OHB systems AG, Fraunhofer HHI has developed an optical seal of ultrathin glass, covering central electronic chips on boards, which for example are responsible for the encoding of data. The state of optical seals, by meaning the signature of the seal, can be proofed simply via glass fiber connector and tamper attacks are recognized immediately.

Technical Contact

Prof. Dr. rer. nat. Wolfgang Schade

Prof. Dr. rer. nat. Wolfgang Schade

Head of Fiber Optical Sensor Systems Department

Phone +49 5321 3816-8410