ECOC 2018

SEP 2018

24 - 26

Rome, Italy

The Fraunhofer Heinrich Hertz Institute HHI is a world leader in the development for mobile and optical communication networks and systems as well as processing and coding of video signals. Together with international partners from research and industry, Fraunhofer HHI works in the whole spectrum of digital infrastructure – from fundamental research to the development of prototypes and solutions.

At ECOC 2018 Fraunhofer HHI presents the latest developments in Photonic Components, Systems and Networks at Fraunhofer Booth 306 from September 24-26 in Rome, Italy.

Press Contact

Anne Rommel

Anne Rommel

Press Officer

Phone +49 30 31002-353

Generic InP Foundry Platform

A generic InP technology to cover a vast variety of monolithic or hybrid integration solutions.

Fraunhofer HHI fabricates individual photonic integrated circuits. Fraunhofer HHI offers an InP platform that integrates receivers (40GHz), transmitters (20GHz) and (1dB/cm) passive components. Partners offer services for design work and packaging.

Technical Contact

Dr.-Ing. Moritz Baier

Dr.-Ing. Moritz Baier

Project Manager

Phone +49 30 31002-690

56 GBd Components for Datacom

56 GBd electroabsorptionmodulated DFB lasers (EMLs) and vertically illuminated photodiodes for datacom applications.

Fraunhofer HHI provides high-speed transmitter and receiver components for 400G Ethernet applications. The components are compliant with the IEEE P802.3bs standard.

Conference Presentations:

  • Mon, Sep 24, 1:45-6:00 pm, Mo4C.2, Moritz Baier: “New Polarization Multiplexed Externally Modulated Laser PIC”
  • Tue, Sep 25, 12:05-12:35 pm, Exhibition/Market Focus, Martin Schell: “InP Solutions For Intra-Datacenter Connects”

Technical Contact

Dr. rer. nat. Martin Möhrle

Dr. rer. nat. Martin Möhrle

Head of Lasers Group

Phone +49 30 31002-724

Indium-Phosphide Mach-Zehnder Modulator

O-Band High-Speed Modulator

Fraunhofer HHI presents the state-of-the-art InP Mach-Zehnder Modulator with ultra-high bandwidth for O-Band applications.

Technical Contact

Dipl.-Phys. Klemens Janiak

Dipl.-Phys. Klemens Janiak

Head of Modulators Group

Phone +49 30 31002-574

Hybrid PICs

The best of all worlds

Fraunhofer HHI’s PolyBoard platform enables the hybrid integration of complex and highly functional photonic integrated circuits (PICs) including active and passive optical functionalities, as well as on-chip free-space-based elements. Recently, ultra-widely tunable lasers with a tunability of more than 90nm along the C-band, and on-chip optical isolators and circulators with an isolation ratio of 20 dB over a bandwidth of 80 nm, have been developed as new optical functionalities of the platform. Furthermore, the possibility of stacking different optical waveguiding layers together with newly developed low-loss vertical MMI couplers (coupling losses <1dB), pave the way towards large-scale 3D PICs.

 

Conference Presentations on Hybrid PICs:

  • Tue, Sep 25, 4:45-5:00 pm, Tu4C.6, Madeleine Nuck: “Low-loss Vertical MMI Coupler for 3D Photonic Integration”
  • Wed, Sep 26, 4:00-4:15 pm, We4C.3, Hauke Conradi: “High Isolation Optical Isolator: A new Building Block for PolyBoard Photonic Integrated Circuits”
  • Wed, Sep 26, 4:15-4:45 pm, We4C.4, David de Felipe: “Ultra-Wide Band Tunable Lasers on the PolyBoard Polymer-Waveguide Based Photonic Integration Platform”

Technical Contact

Norbert Keil

Norbert Keil

Head of Hybrid PICs Group

Phone +49 30 31002-590

Ethernet based Fronthaul system using Real-Time FPGA Platform

Transmission system, which converts Ethernet based fronthaul signals into baseband signal for a radio link (e.g. 5G)

The system supports the methods of synchronous Ethernet and provides a clock signal for the baseband transceiver, which is derived from the fronthaul link.

Technical Contact

Dr.-Ing. Kai Habel

Dr.-Ing. Kai Habel

Project Manager

Phone +49 30 31002-465

Visible Light Communication

Make your light smarter

Fraunhofer HHI presents the new networked Gigabit Visible Light Communication (VLC) system for Internet access via light. Networking multiple light access points enables enhanced coverage and multi-user access, with constant low latency. A standard Ethernet interface allows easy network integration. The new modules are immediately available for industrial prototyping and field tests.

Technical Contact

Priv.-Doz. Dr. rer. nat. Volker Jungnickel

Priv.-Doz. Dr. rer. nat. Volker Jungnickel

Head of Metro, Access and In-house Systems Group

Phone +49 30 31002-768

Compact Optical Transceiver Plugin Card for Real-Time Processing Platform

Compact optical transceiver plug-in card for Fraunhofer HHI’s highly flexible FPGA-based development and demonstration platform for signal processing algorithms and real-time data transmission. Plug-and-play using available graphical user interface (GUI).  In a live demo, the flexible generation and detection of optical data signals, such as 32-GBd PDM-16QAM, will be shown.

Technical Contact

Dr.-Ing. Robert Elschner

Dr.-Ing. Robert Elschner

Project Manager

Phone +49 30 31002-443

International Symposium on Hybrid PICs

Organized by Fraunhofer HHI & Berlin Partner, Cluster Photonics

Hybrid photonic integration enables the development of high-performance components that are complex and cost-effective at the same time. This symposium covers the complete process chain from materials via simulation and fabrication to the final assembly and showcases applications of hybrid PICs in communications and analytics.

The symposium will be held at ECOC on September 26, 2018, and will feature the following speakers:

Chair
Hercules Avramopoulos, ICCS/NTUA, Greece

Speakers List

Paraskevas Bakopoulos, Mellanox Technologies Ltd., Israel
Addressing datacenter challenges with hybrid PICs.

Guillermo Carpintero, Universidad Carlos III de Madrid, Spain
Millimeter-wave Photonic Integrated Circuits: from monolithic to heterogeneous to hybrid.

Douwe Geuzebroek, LioniX International BV, Netherlands
Silicon Nitride hybrid integration: technology and application.

Takaaki Ishigure, Keio University, Japan
Free optical wiring for PIC with polymer realized with the Mosquito method.

Christian Koos, Vanguard Photonics GmbH, Germany
Title: to be announced.

Christos Kouloumentas, ICCS/NTUA, Greece
Hybrid PolyBoard to TriPleX integration for next generation communication and sensing systems.

Michael Lebby, Lightwave Logic Inc., USA
Polymer PICs: Technology and prospects.

Milan Mashanovitch, Freedom Photonics LLC, USA
Versatility of hybrid integration: from sensing to data centers.

Tadao Nagatsuma, Osaka University, Japan
Polymeric devices for terahertz communications.

Hideyuki Nawata, Nissan Chemical Industries Ltd., Japan
Organic-inorganic hybrids materials for PIC technology.

Ignazio Piacentini, ficonTEC GmbH, Germany
Automated assembly and testing of hybrid PICs: targeting high volume manufacturing needs.

André Richter, VPIphotonics GmbH, Germany
The Role of Circuit Simulations for the Design of Hybrid PICs.

Martin Schell, Fraunhofer HHI, Germany
The Future is Plastics: Polymer Based Hybrid Integration for Communication and Sensing.

Bernhard Schrenk, AIT Austrian Institute of Technology GmbH, Austria
Photonic Integration at the Quantum Age – What challenges lie ahead?

Location
ECOC 2018 - Fiera Roma
Room SC2

Date
26. September 2018
9:30 am - 5:00 pm

The official conference language is English.

No attendance fee will be charged but please kindly register.

You can only enter with an ECOC badge. In the end of this registration process, you will find a link to the ECOC website to register as a visitor. Entrance is free.

If you are already registered, there is no need for another registration. Entrance also guaranteed as an exhibitor or congress participant.

Technical Contact

Crispin Zawadzki

Crispin Zawadzki

Deputy Head of Hybrid PICs Group

Phone +49 30 31002-624