ECOC 2019

SEP 2018

22 - 26

Dublin, Ireland

The Fraunhofer Heinrich Hertz Institute HHI is a world leader in the development for mobile and optical communication networks and systems as well as processing and coding of video signals. Together with international partners from research and industry, Fraunhofer HHI works in the whole spectrum of digital infrastructure – from fundamental research to the development of prototypes and solutions.

At ECOC 2019 Fraunhofer HHI presents the latest developments in Photonic Components and Photonic Networks and Systems at Fraunhofer Booth 88, Hall 1 from September 22 to 26 in Dublin, Ireland.

Press Contact

Anne Rommel

Anne Rommel

Press Officer

Phone +49 30 31002-353

Generic InP Foundry Platform

An InP technology to cover a vast variety of monolithic or hybrid integration solutions.

The generic InP integration platform at Fraunhofer HHI continues to be extended. Latest upgrades include components for handling of optical polarization as well as general performance upgrades. Fraunhofer HHI offers an InP platform that integrates receivers (40GHz), transmitters (20GHz) and (1dB/cm) passive components. Partners offer services for design work and packaging.

Technical Contact

Dr.-Ing. Moritz Baier

Dr.-Ing. Moritz Baier

Head of Photonic InP Foundry Group

Phone +49 30 31002-690

Hybrid PICs

Best of all worlds

Fraunhofer HHI’s PolyBoard platform enables the hybrid integration of complex and highly functional photonic integrated circuits (PICs), including active and passive optical functionalities.
Recently on-chip isolators with an isolation ratio of 30 dB over a bandwidth of 100 nm have been developed as new optical functionalities of the platform, utilizing on-chip free-space sections which also allow the integration of nonlinear optical crystals to target applications in Quantum Technology. Further developments include tunable lasers at 1064 nm and 785 nm for sensing and spectroscopy applications and low-loss vertical multi-mode interference couplers in combination with stacked waveguide layers, paving the way to 3D photonic integration.

Technical Contact

Norbert Keil

Norbert Keil

Head of Hybrid PICs Group

Phone +49 30 31002-590

Workshop on Hybrid PICs at ECOC

As part of the ECOC, a workshop on Hybrid PICs takes place on September 22, 2019. Organizers of the event are Norbert Keil, Head of Hybrid PICs Group at Fraunhofer Heinrich Hertz Institute and Hercules Avramopoulos, ICCS/NTUA.

Hybrid Photonic Integrated Circuits (Hybrid PICs) are complex and cost-effective at the same time. This half-day workshop will cover all topics of Hybrid PICs from materials to integration technologies, enabling platforms and modelling tools towards their use in different fields of applications such as communications, quantum technologies, and sensing.

Agenda:

2:00 - 3:30 pm
Materials and Technologies – Session 1
  • Michael Lebby, Lightwave Logic Inc., USA
    Polymer modulators enable the next generation of speeds and low power in optical networks
  • Arne Schleunitz, micro resist technology GmbH, Germany
    Advanced hybrid polymers for optical building blocks in PICs
  • Hideyuki Nawata, Nissan Chemical Industries Ltd., Japan
    Organic-inorganic hybrid materials for co-package
  • Takaaki Ishigure, Keio University, Japan
    Polymer optical waveguide for high-density optical packaging with PICs
  • Douwe Geuzebroek, LioniX International BV, Netherlands
    Hybrid integration of silicon nitride: technology and scaling
  • Ignazio Piacentini, ficonTEC GmbH, Germany
    Automating complex hybrid assembly processes for the PolyBoard requirements
3:30 - 4:00 pmCoffee Break
4:00 - 5:30 pm

Platforms and Applications – Session 2

  • André Richter, VPIphotonics GmbH, Germany
    PDK-enabled layout-aware circuit design and system validation
  • Christos Kouloumentas, ICCS/NTUA, Greece
    Hybrid PolyBoard-on-TriPleX platform for remote ranging and sensing applications
  • Hannes Hübel, AIT Austrian Institute of Technology GmbH, Austria
    Quantum Labs on the Chip
  • Christian Koos, Vanguard Photonics GmbH, Germany
    Hybrid silicon photonics and plasmonics: From optical communications to THz signal processing
  • Guillermo Carpintero, Universidad Carlos III de Madrid, Spain
    Integrated Microwave Photonics: Advantages of a hybrid integration approach based on polymer
  • Paraskevas Bakopoulos, Mellanox Technologies Ltd., Israel
    Scaling data center networks with hybrid PICs

Technical Contact

Norbert Keil

Norbert Keil

Head of Hybrid PICs Group

Phone +49 30 31002-590

PolyPhotonics Berlin e. V.

PolyPhotonics Berlin e. V. offers profound expertise in the area of novel materials, micro optical elements, integration technologies and automated assembly providing customized solutions for applications in telecom, datacom, analytics, sensing and quantum communications.

This year's highlights include novel polymer materials with low optical attenuation and the micro optical bench for applications in quantum communications.

Please contact us – we look forward to realizing your ideas.

Technical Contact

Crispin Zawadzki

Crispin Zawadzki

Deputy Head of Hybrid PICs Group

Phone +49 30 31002-624

Indium-Phosphide Mach-Zehnder Modulator

C- & O-Band High-Speed Modulator

Fraunhofer HHI presents the state-of-the-art InP Mach-Zehnder Modulator for C- and O-Band applications.

Technical Contact

Dipl.-Phys. Klemens Janiak

Dipl.-Phys. Klemens Janiak

Head of Modulators Group

Phone +49 30 31002-574

100GHz Photodetector Modules

Components for 1Tb/s Transmission

Fraunhofer HHI provides 100 GHz single and balanced photodetector modules operating from the O- to the L-band. The intended application for the modules is test and measurement.

Technical Contact

Dr.-Ing. Patrick Runge

Dr.-Ing. Patrick Runge

Head of Detectors Group

Phone +49 30 31002-498

Hybrid Optical Wireless/60GHz Backhaul Link

The Fraunhofer HHI presents a robust, low latency infrared LED link with parallel 60 GHz transmission for mobile backhaul with high availability. Well suited for wireless point-to-point communication in industrial environments.

Technical Contact

Peter Hellwig

Research Associate

Phone +49 30 31002-490

Real-Time 100 Gb/s THz Wireless Transmission

Live demonstration of a real-time 100 Gb/s THz wireless communication link at a carrier frequency of 300 GHz. The demo comprises a single high-speed digital-coherent real-time THz modem and broadband THz transceiver frontends. The Fraunhofer HHI shows a high-resolution video transmission.

Technical Contact

Dr.-Ing. Robert Elschner

Dr.-Ing. Robert Elschner

Project Manager

Phone +49 30 31002-443

Coherent Receiver Frontend

It is crucial to develop ultra-high speed optical components to meet the continuously growing demand for bandwidth. The Fraunhofer HHI researchers developed a 100 GHz Coherent Receiver Frontend (CRF-100G), offering 200 GHz optical bandwidth detection with polarization- and phase-diversity in C+L-band. Its unique feature of customizable optical extender heads enables to retain high signal integrity, resulting in robust testing and measurement performance for cutting-edge research and development activities.

Technical Contact

Dr.-Ing. Mustafa Sezer Erkılınç

Dr.-Ing. Mustafa Sezer Erkılınç

Research Associate

Phone +49 30 31002-586