Photonics West 2019

FEB 2019                                  

2 - 7

San Francisco, USA

The Fraunhofer Heinrich Hertz Institute HHI is a world leader in the development for mobile and optical communication networks and systems as well as processing and coding of video signals. Together with international partners from research and industry, Fraunhofer HHI works in the whole spectrum of digital infrastructure – from fundamental research to the development of prototypes and solutions.

At Photonics West 2019 Fraunhofer HHI presents the latest developments in Photonic Components and Fiber Optical Sensor Systems at Fraunhofer Booth 4545-32, from February 2-7 in San Francisco, USA.

Press Contact

Anne Rommel

Anne Rommel

Press Officer

Phone +49 30 31002-353

CyberGlove - Motion Capture with Nerves out of Glass

Multifunctional fiber sensor platform for human-machine interface or motion capture

A multifunctional fiber sensor platform adapted to a glove for a human-machine interface will be presented. The CyberGlove addresses different applications in motion capturing for Virtual Reality (VR) or Augmented Reality (AR).

Technical Contact

Prof. Dr. rer. nat. Wolfgang Schade

Prof. Dr. rer. nat. Wolfgang Schade

Head of Fiber Optical Sensor Systems Department

Phone +49 5321 3816-8410

InP Foundry Services

Photonic Integration Toolbox

Design your own InP-Based Photonic-Integrated Circuit (PIC) containing passive- and active devices on one substrate (Tape-Out every 3 months). Choose from a range of proven building blocks, such as 40 GHz receivers, 20 GHz DMLs and EAMs, 1 dB/cm passive waveguides, and polarization- rotator and splitter. Low-cost multi-project wafer-run-based PICs are already commercially available through Jeppix , and customer-specific private runs can be realized on demand. Dedicated design and layout software is provided, and several packaging partners are available.

Technical Contact

Dr.-Ing. Moritz Baier

Dr.-Ing. Moritz Baier

Head of Photonic InP Foundry Group

Phone +49 30 31002-690

Hybrid PICs

The best of all worlds

Fraunhofer HHI’s PolyBoard platform enables the hybrid integration of complex and highly functional photonic integrated circuits (PICs) including active and passive optical functionalities. Recently integrated isolators with an isolation ratio of 20 dB over a bandwidth of 150 nm have been developed as new optical functionalities of the platform. They utilize on-chip free-space sections, which allow for the implementation of nonlinear optical crystals to target applications in Quantum Technology.

Furthermore, the possibility of stacking different optical waveguiding layers together with newly developed low-loss vertical multi-mode interference couplers (coupling losses <1dB), pave the way to the 3D photonic integration. Innovative applications such as space division multiplexing, optical phased arrays for LIDAR or large-scale crossing-free switching matrices benefit from the additional flexibility introduced by multiple waveguide layers in PICs.

Technical Contact

Madeleine Nuck

Madeleine Nuck

Research Associate

Phone +49 30 31002-283

Live Terahertz sensing

Next generation terahertz transceiver

Terahertz radiation is increasingly employed in industrial environments for process monitoring and material inspection. The layer thickness of coatings, the structure of polymer components or imperfections in non-conductive materials can be measured.

Fraunhofer HHI presents the next generation of fiber coupled, integrated THz-transceiver heads that are fully compatible with commercial terahertz systems and allow for reflection measurements under normal incidence.

 

 

Technical Contact

Dr. rer. nat. Björn Globisch

Dr. rer. nat. Björn Globisch

Head of Terahertz Sensor Systems Group

Phone +49 30 31002-415

High Speed C and O-band Mach-Zehnder Modulator

Fraunhofer HHI proudly announces the unlimited access to C and O-Band Mach-Zehnder Modulators for more than 64 Gbaud using its mature and efficient Indium Phosphide technology.

Optionally, these modulators are available in an IQ configuration or are monolithically integrated with a DFB laser. Adding Fraunhofer HHI’s expertise in driver co-design for ultra-low power consumption results in e.g. 2.3 pJ/bit for 128 Gbit/s.

Technical Contact

Dipl.-Phys. Klemens Janiak

Dipl.-Phys. Klemens Janiak

Head of Modulators Group

Phone +49 30 31002-574