ECOC 2016

SEP 2016

19 - 21

Düsseldorf, Germany

At this year's ECOC, the Fraunhofer Heinrich Hertz Institute HHI presents its latest solutions in the area of photonic components and photonic networks and systems.

Meet our experts at the booth 350, hall 3 on September 19-21 in Düsseldorf, Germany.

Press Contact

Anne Rommel

Anne Rommel

Press Officer

Phone +49 30 31002-353

InP Foundry Services

Photonic Integration Toolbox

Fraunhofer HHI enables an own design of InP-based photonic-integrated Circuit (PIC) containing passive and active devices on one substrate. It is possible to choose from a range of proven building blocks, such as 40 GHz receivers, 20 GHz transmitters, and 1 dB/cm passive waveguides. Low-cost multi-project-wafer-run-based PICs are already commercially available through Jeppix and customer-specific private runs can be realized on demand. Dedicated design and layout software is provided, and several packaging partners are available.


cycle time = 3 months (starting from October 2016 Tape-Out)



Technical Contact

Dr. rer. nat. Martin Möhrle

Dr. rer. nat. Martin Möhrle

Phone +49 30 31002-724

InP Lasers for Integration into Silicon Photonics

Optical Sources for Si-Photonics

Fraunhofer HHI provides DFB lasers, gain chips and SOAs with flip chip capability for hybrid integration on Si-Platforms. Single devices and arrays are offered for lateral and vertical coupling schemes. InGaAsP and InGaAlAs are used as active MQW layer and operating wavelengths range from 1270 nm to 1650 nm.

Technical Contact

Dr. rer. nat. Martin Möhrle

Dr. rer. nat. Martin Möhrle

Phone +49 30 31002-724

PolyBoard Foundry Services

Our Integration Platform for Your Ideas

The PolyBoard integration platform allows for rapid prototyping, short iteration cycles and low upfront development effort. Fraunhofer HHI's technology allows the integration of on-chip free space elements, 3D structures, graphene electro-absorption modulators, as well as other optical functionalities such as switches, variable optical attenuators, and tunable lasers. Come to our booth to learn about our services including simulation, CAD, technology development, device manufacturing, characterization, and qualification.

Learn more in our talk “Polymer-based Integrated Tuneable laser with On-Chip Wavelength Locker” on Wednesday, September 21st, at 11:30 AM, room 110.

Technical Contact

Norbert Keil

Norbert Keil

Phone +49 30 31002-590

LED based Optical Wireless Backhaul Link

The robust, low latency infrared LED link is well suited for mobile backhaul. The technology is also well suited for wireless point-to-point communication in industrial environments.

Technical Contact

Dr.-Ing. Anagnostis Paraskevopoulos

Dr.-Ing. Anagnostis Paraskevopoulos

Phone +49 30 31002-527

Optical Wireless Links for industrial M2M applications

The robust, mobile data links based on illumination LEDs are insensitive to EM-interference and well-suited for wireless, secure communication in industrial environments.

Technical Contact

Dr.-Ing. Anagnostis Paraskevopoulos

Dr.-Ing. Anagnostis Paraskevopoulos

Phone +49 30 31002-527

Real-time Digital Signal Processing Platform for Terabit Transmission

The Fraunhofer HHI presents innovative solutions for real-time signal processing in optical terabit-class transmission systems. This includes a compact coherent optical receiver (> 70 GHz bandwidth) and a sophisticated processing platform based on 56 GSa/s ADCs and Xilinx Ultrascale® FPGAs. In addition, Fraunhofer HHI portfolio provides a variety of high-performance software algorithms for real-time signal processing and for digital non-linear pre-distortion.

Technical Contact

Dr. rer. nat. Colja Schubert

Dr. rer. nat. Colja Schubert

Phone +49 30 31002-252