19 - 21
At this year's ECOC, the Fraunhofer Heinrich Hertz Institute HHI presents its latest solutions in the area of photonic components and photonic networks and systems.
Meet our experts at the booth 350, hall 3 on September 19-21 in Düsseldorf, Germany.
InP Foundry Services
Photonic Integration Toolbox
Fraunhofer HHI enables an own design of InP-based photonic-integrated Circuit (PIC) containing passive and active devices on one substrate. It is possible to choose from a range of proven building blocks, such as 40 GHz receivers, 20 GHz transmitters, and 1 dB/cm passive waveguides. Low-cost multi-project-wafer-run-based PICs are already commercially available through Jeppix and customer-specific private runs can be realized on demand. Dedicated design and layout software is provided, and several packaging partners are available.
cycle time = 3 months (starting from October 2016 Tape-Out)
InP Lasers for Integration into Silicon Photonics
Optical Sources for Si-Photonics
Fraunhofer HHI provides DFB lasers, gain chips and SOAs with flip chip capability for hybrid integration on Si-Platforms. Single devices and arrays are offered for lateral and vertical coupling schemes. InGaAsP and InGaAlAs are used as active MQW layer and operating wavelengths range from 1270 nm to 1650 nm.
PolyBoard Foundry Services
Our Integration Platform for Your Ideas
The PolyBoard integration platform allows for rapid prototyping, short iteration cycles and low upfront development effort. Fraunhofer HHI's technology allows the integration of on-chip free space elements, 3D structures, graphene electro-absorption modulators, as well as other optical functionalities such as switches, variable optical attenuators, and tunable lasers. Come to our booth to learn about our services including simulation, CAD, technology development, device manufacturing, characterization, and qualification.
Learn more in our talk “Polymer-based Integrated Tuneable laser with On-Chip Wavelength Locker” on Wednesday, September 21st, at 11:30 AM, room 110.
LED based Optical Wireless Backhaul Link
The robust, low latency infrared LED link is well suited for mobile backhaul. The technology is also well suited for wireless point-to-point communication in industrial environments.
Optical Wireless Links for industrial M2M applications
The robust, mobile data links based on illumination LEDs are insensitive to EM-interference and well-suited for wireless, secure communication in industrial environments.
Real-time Digital Signal Processing Platform for Terabit Transmission
The Fraunhofer HHI presents innovative solutions for real-time signal processing in optical terabit-class transmission systems. This includes a compact coherent optical receiver (> 70 GHz bandwidth) and a sophisticated processing platform based on 56 GSa/s ADCs and Xilinx Ultrascale® FPGAs. In addition, Fraunhofer HHI portfolio provides a variety of high-performance software algorithms for real-time signal processing and for digital non-linear pre-distortion.