The best of all worlds

Fraunhofer HHI’s PolyBoard platform enables the hybrid integration of complex and highly functional photonic integrated circuits (PICs) including active and passive optical functionalities. Recently, on-chip isolators with an isolation ratio of 20 dB over a bandwidth of 150 nm have been developed, and are included as new optical functionalities of the platform. They utilize on-chip free-space sections, which also allow for the integration of nonlinear optical crystals to target applications in quantum technologies. Furthermore, in the framework of the BMBF-funded PolyPhotonics project, Fraunhofer HHI presents its latest PIC developments, such as 10G tunable transceivers and fiber Bragg interrogator units for applications in Telecom / Datacom as well as sensing and spectroscopy.

Realtime layer thickness measurement

Terahertz radiation is increasingly employed for process monitoring and material inspection in industry. The layer thickness of coatings, the structure of polymers or imperfections in non-conductive materials can be determined. We present a live demonstration of our latest T-Sweeper spectrometer. The measurements rate of up to 60 points per second allows for thickness measurements in real time. This makes the T-Sweeper a cost-efficient and robust alternative to pulsed systems.

An InP technology to cover a vast variety of monolithic or hybrid integration solutions.

The generic InP integration platform at Fraunhofer HHI continues to be extended. Latest upgrades include components for handling of optical polarization as well as general performance upgrades. Fraunhofer HHI offers an InP platform that integrates receivers (40 GHz), transmitters (20 GHz) and passive components (1 dB/cm). Partners offer services for design work and packaging.

Light Communication for IoT

Fraunhofer HHI presents optical wireless communication in an industrial environment. A moving robot will demonstrate how the high demands of digital networking in industrial environments can be met using optical wireless technology. High robustness and low latency become possible by interference-free operation with spatial diversity at moderate data rates of 100 Mbit/s by the HHI prototypes. The robot receives control information via OWC and sends a video stream.

The Second Fraunhofer Photonic Research Cooperation Workshop will take place on April 25, 2019. It showcases current developments in photonics by Fraunhofer HHI as well as highly regarded partners from Japanese Industry and Academia. The workshop aims to promote international cooperation between Germany and Japan and is hosted by the Optics and Photonics International Exhibition (OPIE) at the Pacifico Yokohama.

OPIE Exhibition Hall, Stage B
April 25, 2019
1:00-4:00 pm

Agenda:

1:00-1:20 pm
Photonics Solutions from Fraunhofer HHI, Martin Schell (Executive Director Fraunhofer HHI, Germany)

1:20-1:40 pm
Optical Communication for 5G Networks, Thomas Haustein (Fraunhofer HHI, Germany)

1:40-2:00 pm
Optical Wireless Backhaul Link: Commercialisation and Application Deployment, Yasu Sengoku (President & COO Sangikyo Japan)

2:00-2:20 pm
An application of VLC to Underwater Robot for High Speed Data Transmission, Takayuki Takahashi
(Fukusima University, Japan)

2:20-2:40 pm
Hybrid Photonic Integration for Communications, Sensing, and Quantum Technology, Moritz Kleinert (Fraunhofer HHI)

2:40-3:00 pm
Polymer optical waveguide for optical packaging with PIC, Ishigure Takaaki (Keio University, Japan)

3:00-3:20 pm
Computer-aided design and technology comparison for integrated photonics and optoelectronics applications, Andre Richter (VPI photonics, Germany)

3:20-3:40 pm
Micro-scale Silicon Photonic Crystal Waveguides as Terahertz Integration Platform, Daniel Headland
(Osaka University, Japan)

3:40-4:00 pm
Optoelectronic Terahertz Systems for Sensing and Communications, Simon Nellen (Fraunhofer HHI, Germany)