Multifunctional fiber sensor platform for human-machine interface or motion capture

A multifunctional fiber sensor platform adapted to a glove for a human-machine interface will be presented. The CyberGlove addresses different applications in motion capturing for Virtual Reality (VR) or Augmented Reality (AR).

Photonic Integration Toolbox

The foundry services for InP-Based Photonic-Integrated Circuits (PIC) received a number of updates in the past year. Latest additions include components for full on-chip polarization handling (rotators and splitters) as well as >20 GHz EAMs. The set of other building blocks consists of lasers (DFB and DBR), optical amplifiers, high-speed (50 GHz) detectors and a range of passive components and low-loss waveguides. Low-cost multi-project wafer-runs are already commercially available through Jeppix  (tape-out every 3 months), and customer-specific private runs can be realized on demand. Dedicated design and layout software is provided, and several packaging partners are available.

The best of all worlds

Fraunhofer HHI’s PolyBoard platform enables the hybrid integration of complex and highly functional photonic integrated circuits (PICs) including active and passive optical functionalities. Recently integrated isolators with an isolation ratio of 20 dB over a bandwidth of 150 nm have been developed as new optical functionalities of the platform. They utilize on-chip free-space sections, which allow for the implementation of nonlinear optical crystals to target applications in Quantum Technology.

Furthermore, the possibility of stacking different optical waveguiding layers together with newly developed low-loss vertical multi-mode interference couplers (coupling losses <1dB), pave the way to the 3D photonic integration. Innovative applications such as space division multiplexing, optical phased arrays for LIDAR or large-scale crossing-free switching matrices benefit from the additional flexibility introduced by multiple waveguide layers in PICs.

Next generation terahertz transceiver

Terahertz radiation is increasingly employed in industrial environments for process monitoring and material inspection. The layer thickness of coatings, the structure of polymer components or imperfections in non-conductive materials can be measured.

Fraunhofer HHI presents the next generation of fiber coupled, integrated THz-transceiver heads that are fully compatible with commercial terahertz systems and allow for reflection measurements under normal incidence.

Fraunhofer HHI proudly announces the unlimited access to C and O-Band Mach-Zehnder Modulators for more than 64 Gbaud using its mature and efficient Indium Phosphide technology.

Optionally, these modulators are available in an IQ configuration or are monolithically integrated with a DFB laser. Adding Fraunhofer HHI’s expertise in driver co-design for ultra-low power consumption results in e.g. 2.3 pJ/bit for 128 Gbit/s.