The Fraunhofer Heinrich-Hertz-Institut (HHI) is a world leader in the development for mobile and optical communication networks and systems as well as processing and coding of video signals. Together with international partners from research and industry, Fraunhofer HHI works in the whole spectrum of digital infrastructure – from fundamental research to the development of prototypes and solutions.

At PIC International 2026, Fraunhofer HHI presents their in-house wafer fabrication capabilities. Powering the next generation of photonic innovation, the wafer fabrication line at HHI offers a unique, end-to-end platform for high-performance PICs. Combining multiple material platforms—including indium phosphide (InP), silicon nitride (SiN), thin-film lithium niobate (TFLN), and polymer technologies—the line enables the realization of highly integrated, application-specific photonic systems across telecom, datacom, sensing, and quantum technologies.