Micro and Nano Engineering Conference 2026

SEP 2026

21 - 24

Interlaken, Switzerland 

The Fraunhofer Heinrich-Hertz-Institut (HHI) is a world leader in the development for mobile and optical communication networks and systems as well as processing and coding of video signals. Together with international partners from research and industry, Fraunhofer HHI works in the whole spectrum of digital infrastructure – from fundamental research to the development of prototypes and solutions.

At Micro and Nano Engineering Conference 2026 Fraunhofer HHI presents the latest developments in Hybrid PICs from September 21-24 in Interlaken, Switzerland.

Contact

Dr.-Ing. Dominic Schulz, MBA

Dr.-Ing. Dominic Schulz, MBA

Head of Business Development & Strategy

Phone +49 30 31002-694

Presentation: "Wafer-Scale Microfluidic Integration for Silicon Nitride Photonic Biosensors"

Fraunhofer HHI presents a wafer-scale microfluidic integration platform for Si₃N₄ microring-resonator photonic integrated circuits, enabling multiplexed, label-free biosensing with minimal sample volumes. By combining CFD-optimized microfluidic design with scalable wafer-level bonding and sealing processes, the approach provides a manufacturable hybrid photonic-fluidic platform and adds integrated sample delivery as a key function for next-generation photonic biosensors.

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Technical Contact

M. Sc. Laurids von Emden

M. Sc. Laurids von Emden

Research Associate

Phone +49 30 31002-259