At a Glance
- 32 GBd differential driver for telecom and datacom application
Technical Background
HHI provides back-terminated SiGe linear driver IC for InP Mach-Zehnder modulator.It features with 2 x 25 Ω back-termination for the impedance matching with the modulator. Upon customer‘s request, HHI provides customized linear driver IC for the modulator using co-design techniques.
Features
- Differential input and differential output
- Back-terminated outputs
- 3.0 Vpp differential output at 2 x 25 Ω loads
- Low EVM and BER in electro-optical measurement
- Adjustable output swing
- Twin-channel driver available
Applications
- Mach-Zehnder modulator driver
- Broadband signal amplification conversion
Specifications
| Parameter | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|
| Bandwidth | 28 | GHz | P (in,diff) = -1dBm | ||
| Power | 370 | 660 | mW | without coil, with coil: 310 (min), 510 (typ) mW | |
| Data Rate | 32 | GBd | |||
| Rise/fall time | 12.5 | ps | 20%-80% | ||
| Group Delay Distortion* | ± 8 | ps | |||
| Jitter (p-p) | 4.6 | ps | |||
| Differential Input Signal | 700 | mVpp | AC-coupled | ||
| Differential Output Signal | 1.7 | 3 | Vpp | 2 x 25 Ω load | |
| P (1dB) | 13.4 | dBm | output-refered, Z (load.diff) = 50 Ω | ||
| CMRR* | 18.6 | dB | up to 20 GHz | ||
| Chip Dimension | 1030 (H) x 900 (V) | 1030 (H) x 900 (V) | 1030 (H) x 900 (V) | µm | dicing distance excluded |
| Operation Temperature | 40 | ˚C |
*denotes that measurements were carried out at room temperature condition, 23˚C. Unless noted, measurement temperature was 40˚C