Detectors
We offer development and manufacturing of photodetector chips and modules for the infrared wavelength range of 780 nm up to 2500 nm. Our research topics cover tele-/datacom applications with high-speed photodetectors as well as sensing devices with high sensitive InGaAs photodiode arrays.
Head of Group: Dr.-Ing. Patrick Runge
Modulators
The Modulator Group (MOD) is developing InP based Modulators with a travelling wave electrode design.
Head of Group: Dr.-Ing. Patrick Runge
Lasers
InP-based Lasers, EMLs, SOAs, MLLs and Gain Chips are being developed for a variety of applications in the area of optical tele- and data communications and sensors.
Head of Group: Dr. rer. nat. Martin Möhrle
Photonic InP Foundry
We offer foundry services to external partners to allow customers/designers to acquire InP-based Photonic-Integrated Circuits (PICs) for any particular application.
Upcoming Mask Tape-Out Dates for design submission:
HHI31 22 Aug 2023
HHI32 22 Nov 2024
HHI33 22 Feb 2024
HHI34 22 May 2024
Head of Group: Dipl.-Phys. Klemens Janiak
Hybrid PICs
We enable the hybrid integration of complex photonic components for telecom, datacom and sensing applications with our PolyBoard and Silicon Nitride platforms. Contact us to learn how we can help in realizing your ideas!
Head of Group: Dipl.-Ing. Norbert Keil
Terahertz Sensors and Systems
The Terahertz Sensors and Systems Group (THZ) applies its telecom matured InP-technology for developing photomixers and photoconductive antennas which convert optical signals in the 1.5 µm wavelength range into THz radiation and vice versa.
Head of Group: Dr. Robert Kohlhaas
IC Design
The IC Design Group (ICD) develops high-speed IC for optical communications and provides high-frequency measurements and electromagnetic analysis.
Contact: Dr. Jung Han Choi
Epitaxy
The Epitaxy Group (EPI) manufactures and develops InP-based wafers for optical and opto-electronic components.
Head of Group: Dr. rer. nat. Christoph Hums
Processing
The Fraunhofer HHI has industry standard cleanroom facilities of ISO classes 4 to 6 (former classes 10 to 1000). The complete process line starts with ebeam lithography for mask fabrication and direct writing and includes all technology steps up to final electroplating and AuSn-sputtering for contact-pads or flip-chip-bumps.
Head of Group: Dr. rer. nat. Kristijan Posilovic
Backend
The Backend group develops and carries out processes for separation and optical coating of Indium-phosphide-chips (InP).
Head of Group: M.Sc. Maximilian Herzog
Packaging
The Packaging group constructs modules to demonstrate the capabilities of the optical and optoelectronic devices which are developed at Fraunhofer HHI. This includes optical fiber coupling as well as electrical interfaces with RF connectors.
Additionally they design and construct tailor-made module prototypes or submounts for all external partners and customers.
Head of Group: B. Eng. Felix Ganzer