Research Groups

Detectors

The Detector Group (DET) develops and manufactures high-speed photodetectors and photoreceivers as optoelectronic integrated circuits (OEICs) based on InP according to customer specifications, preferably for the 1.3 - 1.55 µm wavelength region with 1-150 GHz speed of operation.

Head of Group: Dr.-Ing. Patrick Runge

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Modulators

The Modulator Group (MOD) is developing InP based Modulators with a travelling wave electrode design.

Head of Group: Dipl.-Phys. Klemens Janiak

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Lasers

Lasers, EMLs, SOAs and Gain Chips are being developed for a variety of applications in the area of optical tele- and data communications and sensors.

Head of Group: Dr. rer. nat. Martin Möhrle

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Foundry Services for InP-Based Photonic Integrated Circuits

We offer foundry services to external partners to allow customers/designers to acquire InP-based Photonic-Integrated Circuits (PICs) for any particular application.

Tape-Out Dates for Design Submission:

15 Oct 2017
15 Jan 2018
16 Apr 2018
16 Jul 2018
15 Oct 2018

Head of Group: Dr. rer. nat. Martin Möhrle, Moritz Baier

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Hybrid PICs

We enable the hybrid integration of complex photonic components for telecom, datacom and sensing applications with our PolyBoard and Silicon Nitride platforms. Contact us to learn how we can help in realizing your ideas!

Head of Group: Dipl.-Ing. Norbert Keil

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Terahertz Sensors and Systems

The Terahertz Sensors and Systems Group (THZ) applies its telecom matured InP-technology for developing photomixers and photoconductive antennas which convert optical signals in the 1.5 µm wavelength range into THz radiation and vice versa.

Head of Group: Dr. rer. nat. Björn Globisch

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IC Design

The IC Design Group (ICD) develops high-speed IC for optical communications and provides high-frequency measurements and electromagnetic analysis.

Contact: Dr. Jung Han Choi

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Diffractive Optical Elements

Our portfolio of elements, mainly implemented in quartz glass, silica and silicon, covers the wavelength range from the DUV to the IR region.

Contact: Dipl.-Phys. Margit Ferstl

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Epitaxy

The Epitaxy Group (EPI) manufactures and develops InP-based wafers for optical and opto-electronic components.

Head of Group: Dr. rer. nat. Christoph Hums

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Processing

The Fraunhofer HHI has industry standard cleanroom facilities of ISO classes 4 to 6 (former classes 10 to 1000). The complete process line starts with ebeam lithography for mask fabrication and direct writing and includes all technology steps up to final electroplating and AuSn-sputtering for contact-pads or flip-chip-bumps.

Head of Group: Dipl.-Phys. Detlef Schmidt

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Backend & Packaging

The Backend and Packaging Group (BaP) separates the photonic components developed at Fraunhofer HHI into chips, carries out optical coating processes and assembles the devices into demonstration modules and submounts.

Head of Group: Dipl.-Ing. (FH) Greta Ropers

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