Hybrid Integration Technology
HHI’s hybrid integration technology enables rapid prototyping, short iteration cycles along with low development effort and cost. Our expertise includes design and simulation, CAD, technology development and device manufacturing as well as characterization, assembly and qualification.
The following photonic integration platforms are available:
- The PolyBoard platform based on integrated single mode polymer waveguides
- Passive waveguide structures like MMIs, AWGs, gratings;
- Thermo-optic structures like TO-shifters, VOAs, tunable gratings;
- µBench with slots, U grooves and vertical mirrors to integrate micro lenses, NLO crystals, isolators, and thin film elements (PBS, λ/2 plates, λ/4 plates, high pass, low pass filters);
- 3D photonic integrated elements like 3D MMIs and 3D optical phased arrays for optical beam forming and beam steering;
- The SiN platform based on integrated single mode silicon nitride waveguides:
- Passive waveguide structures like ring resonators, MMIs, AWGs, gratings.
- Thermo-optic structures like TO-shifters, VOAs, tunable gratings;
- The TFLN platform based on integrated single mode thin film lithium niobate waveguides.
These platforms can be used either individually or combined together to meet specific application requirements. In addition, all platforms can be hybrid integrated with InP, GaAs or GaN active elements such as lasers, detectors, gain chips and modulators to form complex hybrid photonic integrated circuits.
HHI’s RF FlexLines are based on electrical co-planar waveguides and can be used for connecting photonic and electronic components in a single manufacturing step. Our RF FlexLines offer superior impedance matching and shielding capabilities over traditional wire bonds at very high frequencies (200 GHz and beyond).
