Hybrid PICs

The Hybrid PICs team develops photonic components and hybrid integrated circuits based on PolyBoard, SiN and thin film lithium niobate (TFLN) single mode waveguides in combination with active elements made of InP, GaAs or GaN.

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Research Topics

We are working to harness the unique properties of light for applications in fiber-based communications, quantum technologies, microwave photonics and 6G wireless networks and beyond, as well as life sciences, medicine, sensing and analytics. Examples of components under development include terabit transmitters for data centers, compact and low-cost THz sources, and functionalized micro ring resonator PICs for innovative point-of-care diagnostics.

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Explore the current and finished projects of the Hybrid PICs Group. Realized for public and industrial clients.

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Your partner for research and product development: Get in contact with our scientists.

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Funding Opportunity

Apply for an EU ACTPHAST Project to obtain your first Polymer-Based Prototypes at a very low cost.