Photonic InP Foundry

The Photonic InP Foundry Group (FOU) offers foundry services to external partners to allow customers/designers to acquire InP-based Photonic-Integrated Circuits (PICs) for any particular application. Dedicated software can be provided to the user for the design and layout of the PIC. The so-called generic foundry approach is used for the design of the PIC. The user/designer can choose from a list of fixed photonic devices offered by Fraunhofer HHI, called building blocks (BBs), to add to his PIC design. Afterwards, the designer can optically route the BBs together using the interconnect waveguides. The cross-section of the interconnect waveguides are also made available to the designer, and as a result, the designer can also simulate and design his/her own passive photonic devices (such as MMIs and AWGs) and add to the PIC layout.

Fraunhofer HHI currently offers a foundry platform for both transmit- and receive applications containing the following BBs:

  • optical interconnect waveguides: weakly- and strongly-guiding (propagation loss ~ 1.0 dB/cm)
  • low-loss optical-transition from weakly- to strongly-guiding waveguide (and vice versa)
  • MMI couplers (1x2, 2x2)
  • directional coupler
  • spot-size converter for low-loss coupling to standard single-mode fiber (on-chip mode conversion; <2 dB fiber-chip coupling loss)
  • phase shifter (thermo-optic, electro-optic, and current-injection)
  • pin photodiode (up to 50GHz bandwidth)
  • balanced detectors (up to 40GHz bandwidth)
  • optical amplifier (SOA)
  • tunable DBR grating (C-band wavelength range)
  • directly-modulated DFB laser (C-band wavelength range; up to 20GHz modulation frequency)
  • electro-absorption modulator (EAM, 20GHz)
  • polarization splitter
  • polarization converter/rotator
  • electrical routing (for DC- and high-frequency electrical signals), including crossing elements of the electrical interconnects with the optical waveguides


Fraunhofer HHI offers two types of foundry services to external partners:

  1. cost-effective generic foundry service for small quantities of PICs in a multi-project wafer scheme (MPW) (service provided through the brokering organization Jeppix;
  2. fully custom-made foundry service targeting the customer´s specifications (please contact us directly for more information on this option)

Upcoming tape-out Dates for design submission:

15 Jul 2020
15 Oct 2020
15 Jan 2021


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