At a Glance
- Flexible RF Interconnection >100 GHz
Technical Background
Flexible RF transmission lines are highspeed interconenction medium for highspeed components. It can especially exploited to isolate thermal interactions between devices, e.g. driver IC and optical components. Also, it supports flexible 3-D packaging, multichip modules, optoelectronic modules, and wearable packaging applications.
Features
- Flexible interconnection
- Excellent RF performance >100 GHz
- 4“ -wafer fabrication
- Customized design
Applications
- Optoelectronic modules, submount
- 3-D packaging
- Multichip Modules
- Applications for thermal isolation
- Folderble, wearable applications
Specifications
| Parameter | Value |
|---|---|
| Dielectric constant | 2.7 |
| Tangent loss 30 GHz | 0.002 |
| Polymer layer thickness | 10 - 15 µm |
| Conducer (Au) thickness | 3.5 µm |
| Parameter | Value |
|---|---|
| Insertion losses |
0.48 dB @ 30 GHz 0.75 dB @ 100 GHz |
| Reflection | < -17 dB (up to 100 GHz) |
| Group delay distortion | ± 3 ps |
