The Technology and Infrastructure department provides the technological backbone for the development and fabrication of photonic components and Photonic Integrated Circuits (PICs). It spans the entire value chain – from epitaxy and wafer processing to backend technologies and advanced packaging – offering a comprehensive and integrated technology platform.
The department develops and operates state-of-the-art semiconductor technologies for high-speed data transmission, detection, and sensing applications. Within ISO-certified cleanroom and production environments, it supports research and development projects as well as pilot and small-volume manufacturing for industrial partners.
As an active partner within the Research Fab Microelectronics Germany (FMD), the department is embedded in a national technology network that combines extended process platforms, scalable manufacturing infrastructures, and a broad micro- and nanoelectronics portfolio. This close integration of material development, process engineering, and assembly and packaging technologies enables the efficient transfer of photonic devices from design to application – ranging from telecom and sensor systems to terahertz technologies.
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