Epitaxy
The Epitaxy Group (EPI) manufactures and develops InP-based wafers for optical and opto-electronic components.
Head of Group: Dr. rer. nat. Christoph Hums
Processing
The Fraunhofer HHI has industry standard cleanroom facilities of ISO classes 4 to 6 (former classes 10 to 1000). The complete process line starts with ebeam lithography for mask fabrication and direct writing and includes all technology steps up to final electroplating and AuSn-sputtering for contact-pads or flip-chip-bumps.
Head of Group: Dr. rer. nat. Kristijan Posilovic
BAP - Backend and Packaging
The Backend and Packaging group investigates the complete post‑fabrication process chain of InP‑based photonic devices, including chip separation, optical thin‑film deposition, and the assembly of functional optoelectronic modules. Advanced packaging concepts, precise optical fiber coupling, and high‑frequency electrical interfaces ensure reliable integration of photonic components.
Head of Group: B. Eng. Felix Ganzer