January 14, 2019

Project DigitalTWIN at the BAU 2019

January 14, 2019

The project DigitalTWIN, in which the Fraunhofer HHI plays a key role, is going to be presented at the BAU 2019 at the booth of se commerce GmbH. The fair for architecture, materials and systems is taking place from January 14-19 in Munich.

In June 2018, the research project DigitalTWIN – Digital Tools and Workflow Integration for Building Lifecycles – had its official kick-off. Project partners from industry and research are going to continue developing digital tools and technologies until 2021 in order to connect and automate services, processes and procedures along the value chain of the construction industry. DigitalTWIN focuses on understanding systemic dependencies and interactions. The research project aims at a modular approach so that the individual, company's internal IT system landscape can be integrated as flexibly and securely as possible. Key technologies from the areas of 5G, Multi-Access-Edge-Computing (MEC), Cloud-Computing, Virtualization, CAD/CAM, BIM and Data Analytics are used.

The research project DigitalTWIN was designed by the research partners se commerce GmbH, the Fraunhofer Heinrich Hertz Institute, Telegärtner Karl Gärtner GmbH, Carl Zeiss 3D Automation GmbH, planen-bauen 4.0 and Werner Sobek Stuttgart AG. The focus of the project is on the automated and integrated linking of processes as well as on the use of future-oriented technologies, such as VR/AR technology, Smart Data Services, BIM services and Machine Learning.

Interested parties can find out more about the research project in Hall C5, Booth 130.