Hybrid Integration and Sensing

The Hybrid Integration and Sensors Department develops highly integrated photonic systems and innovative sensor solutions for demanding applications in communication, industry, and security. The focus is on the integration of photonic integrated circuits (PICs) with electronic, optical, and microsystem components to create high-performance, application-specific system solutions.

By combining different material platforms and integration technologies, the department develops compact, energy-efficient, and scalable modules. It addresses the full system level, ranging from the conception and design of hybrid PIC architectures to packaging and interconnection technologies, as well as system characterization and validation.

A particular focus lies on terahertz sensors and systems, as well as photonic solutions for high-precision measurement and detection. Based on photonic terahertz sources and detectors, the department develops advanced sensor systems for industrial process monitoring, non-destructive testing, security applications, and specialized communication scenarios, with the aim of transferring robust technologies into real-world applications.