At a Glance
- Ultra-fast, low-loss and flexible electrical interconnects for opto-electrical packaging
Technical Background
Ultra-fast, low-loss and flexible electrical coplanar waveguides for interconnecting drivers to laser and photo detectors to transimpedance amplifieres (TIAs) with bandwiths exeeding 200 GHz
Characteristics:
- Fabricated on wafer scale
- Customized design available
- Flexible electrical interconnects
- RF characterization set-up
- Transmission: >> 200 GHz
- Reflection: <-20 dB
Features
Polymer embedded electrical coplanar waveguides.
- Bandwidth > 200GHz
- Customized design
- mm to cm scale
Applications
High speed flexible electrical chip to chip interconnect:
- Driver-to-LD
- PD-to-TIA
