At a Glance
- InP light sources for application in photonic multi-chip approaches
Features
- flip-chip configuration
- horizontal and vertical integration (2D and 3D)
- integrated taper for low optical coupling loss & relaxed alignment tolerance
- lateral & vertical positioning
- etched facets on request
- flexible adaption of devices corresponding to customer´s photonic platforms
Applications
- Datacom / Telecom
- Sensors
Photonic platforms
- Silicon on Insulator (SOI)
- Silicon-Nitride (SiN)
- Lithium Niobate-On-Insulator (LNOI)
- Glass
- Polymer
Functionality
- high power DFB-lasers
- high power gain chips
- high speed gain chips
- semiconductor optical amplifiers
- (SOAs)
Configuration
- horizontal and vertical emitters
- single chips and array
