At a Glance
- InP gain elements for application in photonic multi-chip approaches
Features
- p-side up or flip-chip configuration
- Integrated taper for low loss optical coupling
- Circular optical far field, FWHM <20°
- On request precise alignment structures for lateral & vertical positioning
- Flexible adaptation of devices corresponding to customer’s photonic platforms
Applications
- Telecom/Datacom
- Sensors
Device Variants
- Single chips and arrays
- High power
- High speed
Photonic Platforms
- Silicon on Insulator (SOI)
- Silicon-Nitride
- Lithium Niobate-On-Insulator (LNOI)
- Glass
- Polymer
