APECS - Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
APECS is a pan-European pilot line for advanced chip packaging and heterogeneous integration to strengthen European semiconductor innovation.
Duration: since November 2024 till June 2029
Budget: € 730 million
Partners
- Fraunhofer-Gesellschaft (Coordinator of APECS-Consortium)
- Ferdinand-Braun-Institut (Leibniz, Germany)
- IHP-GmbH (Leibniz, Germany)
- CEA-Leti (France)
- imec (Belgium)
- VTT (Finland)
- TU Graz (Austria)
- FORTH (Greece)
- IMB-CNM, CSIC (Spain)
- INL (Portugal)
Project Description
APECS establishes a leading European pilot line for advanced packaging and heterogeneous integration that bridges cutting-edge research with industrial implementation. By going beyond conventional packaging technologies, the project enables the development of robust, trusted heterogeneous systems and supports European industry in securing technological sovereignty and competitiveness.
Objectives
- Establish a pan-European infrastructure for advanced packaging and heterogeneous integration
- Provide open access to state-of-the-art technologies for industry, SMEs, start-ups, and research communities
- Link applied research with scalable pilot production
- Advance standardization and scale-up of innovative integration methods through System-Technology Co-Optimization (STCO)
- Strengthen resilient European semiconductor supply chains
- Contribute to sustainable and climate-neutral production practices