Photonic Integrated Circuits

Why settle for limits? We empower your existing systems with tailored photonic neural networks. Harnessing amplitude and phase, our photonic integrated circuits boost your applications from telecom to sensing, adding new capabilities and unmatched efficiency.

Read more

Single Photon Detection for Quantum Communication and Sensing

Fraunhofer HHI provides photodetector modules for single photon detection operating from the O- to the L-band. The SPAD chips inside the modules are based on mature InP technology and are fabricated in the wafer process line of Fraunhofer HHI, with Telcordia and space-qualified processes. The SPAD supply chain is completely within EU, including packaging at the Fraunhofer HHI facility.

Read more

Hybrid integration and micro-optical bench

The PolyBoard wafer technology with its active/passive hybrid integration and micro-optical bench enables the implementation of photonic integrated circuits for quantum technologies, e.g. QKDs transmitters for polarization encoding and photon pair sources featuring on-PIC nonlinear crystals.

Read more

High power laser diodes with 4.9 W CW-output power @ 1550 nm

Fraunhofer HHI offers high-power laser with an optical CW-output power of up to 4.9 W for use in the C-band wavelength range. The application areas of the laser range from medical technology and pump sources for solid-state lasers to range finding, LiDAR and material processing.

Read more

Mode-Locked and External-Cavity Lasers

Fraunhofer HHI’s SiN wafer line enables for the hybrid integration of SiN PICs with active InP components for mode-locked lasers with a tailored repetition rate and external cavity tunable lasers operating at NIR wavelengths.

Read more

Application-specific PICs from NIR down to VIS

Fraunhofer HHI offers SiN PICs that can be customized for different applications and wavelength ranges. Photonic building blocks including ring resonators, MMIs, tunable gratings and phase shifters are available. Optimized interfaces allow for the hybrid integration of lasers, gain chips and detectors. Furthermore, surface functionalization together with wafer-level micro-fluidics enables the use of the SiN wafer technology in life sciences, analytics and sensing.

Read more

TFLN PICs for Communication and Sensing

Fraunhofer HHI offers high-speed phase modulation for 100+ GHz Mach-Zehnder modulators on TFLN PICs. The broad optical spectrum from 450 - 4500 nm allows for a wide range of applications in sensing, communication and quantum. First building blocks for customized wafer fabrication are available and regular TFLN MPW runs are coming soon.

Read more

Higher dynamic range in THz time-domain spectroscopy thanks to new emitters with up to 1 mW THz power

Fraunhofer HHI’s latest generation of pulsed terahertz (THz) emitters enables fully fiber‑coupled THz time‑domain spectrometers with up to 1 mW of THz power. Achieved through systematic optimization of the ultrafast photoconductive material, this advancement expands dynamic range—especially for highly absorbing samples and for measurements requiring short acquisition times.

Read more

Unprecedentedly high intermediate frequency of 40 GHz enables broadband terahertz communication and fast spectroscopy and ranging from 100 GHz to 5.5 THz.

Fraunhofer HHI’s photonic terahertz (THz) components and systems are at the forefront of THz communication and frequency‑range spectroscopy. We present the first optoelectronic heterodyne receiver supporting intermediate frequencies up to 40 GHz. Built on our latest ultra‑wideband photoconductive THz antennas and dedicated high‑frequency design, the receiver delivers high‑IF signals directly at the coaxial output—enabling compact, high‑performance solutions for your application.

Read more