Alcatel Thales III/IV Lab (F), GIGOPTIX-HELIX (CH), ICCS/NTUA (GR), LINKRA-TELEOPTIX (I)
POLYSYS will use electro-optic polymer as an integration platform where 100Gb/s modulators will be integrated monolithically, whereas InP lasers, detectors and electronics will be integrated hybridly.
Direct 100G connectivity with optoelectronic POLYmer-InP integration for data center SYStems
POLYSYS is a specific-target research program (STREP) co-funded by the European Commission under the 7th Framework Progremme (FP7). The aim is to disrupt the capacity upgrade in data communication systems by providing an integration technology based on polymers for straightforward serial 100 Gb/s rack-to-rack and chip-to-chip connectivity and 400 Gb/s connectivity via short range links up to 800m.
HHI is participating in POLYSYS project with its polymer group and detector group. HHI will design complex passive structures (i.e. multi-mode interference couplers-MMI couplers and Bragg-gratings) on the elecro-optic polymer platform and will develop the required techniques for the hybrid integration of active InP elements with the polymer boards. HHI will also develop arrays of ultra-high speed InP photodiodes and photoreceivers and will take actively part in the system integration and packaging of the receiver modules.