PATTERN aims to revolutionize microwave photonics by introducing the world's first PDK for ultra-high frequencies above 100 GHz, incorporating InP, LNOI, and novel materials like YIG to advance PIC capabilities and surmount existing high-frequency packaging challenges.

Duration: September 2022 - August 2026


University College London (UK)
Luceda Photonics Luceda (BE)
Fraunhofer Heinrich‐Hertz‐Institut HHI (DE)
Interuniversity Microelectronics Centre IMEC (BE)
Centre National de la Recherche Scientifique CNRS (FR)
Microwave Photonics GmbH MWP (DE)
Centre Suisse d’Electronique et de Microtechnique SA (CH)

Project Description

PATTERN will bring the world’s first process design kit (PDK) for microwave photonics at ultra‐high frequencies above 100 GHz as well as new functionalities into PICs such as magneto‐optics isolators and acousto optics modulators (AOM). PATTERN’s approach to ultra‐high frequencies is holistic and includes all the aspects such as design and simulation, generation, detestation, modulation, and packaging. To achieve this goal, we propose a massive hybrid integration of several different PIC platforms such as InP and LNOI but also including new materials such as Yttrium Iron Garnet (YIG). We also develop co‐integration of electronic SiGe chips with PICs which especially a necessity in ultra‐high speeds.

LNOI is of the most promising emerging materials for PICs that comprises a unique set of interesting optical properties: a high electo‐optic coefficient, a high intrinsic 2nd‐order nonlinearity, and a large transparency window which makes it ideal for electronics manipulation of light at many wavelength s (EO modulation). InP is an ideal platform for generation and detection of light and YIG is a known magneto‐optics material. If put together, truly novel, and advanced functionalities and opportunities arise. In addition, in PATTERN we developed packaging solutions and for such high frequencies which one of the main barriers in this field. Moreover, we also develop software expertise for design automation (e.g. RF signal routing) and end‐to‐end circuit simulation and design which is extremely challenging at these frequencies. We also demonstrate the capabilities of the platform in 6 different application‐oriented prototypes.

To achieve these objectives, PATTERN put together the expertise of 10 well know SMEs, RTOs and industrial players to achieve these objectives in 48 months project. Once developed, PATTERN will pave the way for the new generation of advanced PIC products in wide range of applications from telecom, 5G/6G to quantum technologies, LiDAR and sensing.