PIXAPP provides the full range of assembly and integration technologies needed to package multifunctional PIC (Photonic Integrated Circuit) devices, across all stages of manufacturing - from prototyping to medium scale manufacture.
PIXAPP is the world's first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, and helps users exploit the breakthrough advantages of PIC technologies.
PIXAPP consists of a highly-interdisciplinary team of Europe's leading industrial and research organisations, and provides users with single-point access to PIC assembly and packaging.
The Pilot Line Gateway Office is PIXAPP's the easy-access interface for external users, and is located at the Tyndall National Institute, in Ireland. The Gateway is managed by an experienced team, including technical experts to review incoming user requests, and project managers to organise the PIXAPP supply chain.
It bridges the 'valley of death' often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market.
- ensures that users have single facility wherein they can find the technologies and expertise needed to support their full packaging requirements.
- has the capacity to manage multiple users simultaneously, ensuring fast process cycle-times and minimum delays between incoming user orders and delivery of packaged PICs.